3D flash memory is “a major leap” in scaling and wafer bonding technology

Kioxia Europe and Western Digital have announced a 3D flash memory which the partners describe as “groundbreaking” architecture in scaling and wafer bonding technology and which can “deliver a major leap in performance, density and cost effectiveness”. The 218-layer 3D flash memory leverages 1Tb triple-level-cell (TLC) and quad-level-cell (QLC) with four planes and features lateral […]

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