Arizona State University (ASU) and Deca Technologies (Deca), a premier provider of advanced wafer- and panel-level packaging technology, today announced a groundbreaking collaboration to create North America’s first fan-out wafer-level packaging (FOWLP) research and development center. The new Center for Advanced Wafer-Level Packaging Applications and Development is set to catalyze innovation in the United States,…
The post ASU and Deca Collaborate on Wafer Packaging appeared first on EPS News.
Read More
EPS News