admin

Rohm mixes up automotive interiors with RGB Chip LED 

An RGB (red, green, blue) chip LED for automotive interiors minimises colour variations due to colour mixing in vehicle interiors where coloured LEDs are used to indicator cabin function or status as well as accent lighting. The SMLVN6RGBFU can be used in instrument clusters, centre information displays and accent lighting for footwells and door handles,

Rohm mixes up automotive interiors with RGB Chip LED  Read More »

Alliance Memory combines NAND flash and eMMC controller in FPGA package

Compliant With JEDEC eMMC v5.1, the ASFC16G31M-51BIN integrates NAND flash memory with an eMMC controller and flash transition layer (FTL) management software in a single 11.5 mm by 13 mm 153-ball FBGA package. The 16Gbyte industrial grade device is available from Alliance Memory. The device for solid-state storage in consumer, industrial, and networking applications features

Alliance Memory combines NAND flash and eMMC controller in FPGA package Read More »

Low noise digital readout IC is available for commercial SWIR use

The latest digital readout integrated circuit (DROIC) from Senseeker Engineering is the RD0033 Neon. It was developed for low light applications such as short wave infrared (SWIR) and low current detector technologies such as quantum dots-based detectors.  The Neon RD0033 has a 640 x 512 format and a frame rate of 700 frames per second.

Low noise digital readout IC is available for commercial SWIR use Read More »

Teledyne e2v and Infineon partner on optimised processor boot solution for high reliability edge computing space systems

Infineon Technologies and Teledyne e2v have developed a reference design for the implementation of compute-intensive space systems. The design, built around a Teledyne e2v QLS1046-Space edge computing module, which is configured by the radiation-hardened 64MByte Infineon SONOS based NOR Flash memory, enables high performance space processing applications. The reference design addresses two inherent challenges in

Teledyne e2v and Infineon partner on optimised processor boot solution for high reliability edge computing space systems Read More »

6 Tips for Managing the Costs of Obsolescence

We have all heard stories of products being launched with obsolete components. This is a particularly relevant issue for customers with lengthy development and qualification cycles. For example, the auto industry’s dependence on legacy electronics products is one reason the sector has been struggling with semiconductor supplies. Much of the equipment designed for military and…

6 Tips for Managing the Costs of Obsolescence Read More »

Two SiC MOSFETs from Diodes are automotive-compliant

The wide bandgap portfolio at Diodes has been extended with the addition of two SiC MOSFETS. The DMWSH120H90SM4Q and DMWSH120H28SM4Q have been engineered to enhance automotive subsystems’ efficiency, said the company. The N-channel MOSFETs respond to the increasing market demand for SiC solutions that enable better efficiency and higher power density in electric vehicle /

Two SiC MOSFETs from Diodes are automotive-compliant Read More »

Nexperia launches into IGBT market with 600V discrete models

A 30A IGBT, qualified to 175 degree operation mark Nexperia’s entry into the IGBT market.  The NGW30T60M3DF enables higher power density in power conversion and motor drive applications, including industrial motor drives such as servo motors ranging from 5.0 to 20kW (20kHz), robotics, elevators, operating grippers, in-line manufacturing, power inverters, uninterruptible power supply (UPS), photovoltaic

Nexperia launches into IGBT market with 600V discrete models Read More »

Scroll to Top