Cube architecture targets powerful edge AI devices, says Winbond

Affordable edge AI computing can be enabled in mainstream use cases with the CUBE customised ultra-bandwidth elements) architecture which has been introduced by Winbond Electronics. The architecture optimises memory technology for seamless performance running generative AI on hybrid edge/cloud applications. CUBE enhances the performance of front-end 3D structures such as chip on wafer (CoW) and […]

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