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Five semiconductors in AcePack SMIT packages enhance power density

Automotive-grade devices from STMicroelectronics run cooler in the surface mount  AcePack SMIT package which eases assembly and enhances power density over conventional TO-style packages, said ST Microelectronics. Engineers can choose from two STPower 650V MOSFET half bridges, a 600V fast diode bridge, a 1,200V half-controlled full-wave rectifier, and a 1,200V thyristor-controlled bridge leg. All devices […]

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