Site icon The Passive Times

Five semiconductors in AcePack SMIT packages enhance power density

Automotive-grade devices from STMicroelectronics run cooler in the surface mount  AcePack SMIT package which eases assembly and enhances power density over conventional TO-style packages, said ST Microelectronics. Engineers can choose from two STPower 650V MOSFET half bridges, a 600V fast diode bridge, a 1,200V half-controlled full-wave rectifier, and a 1,200V thyristor-controlled bridge leg. All devices […]

The post Five semiconductors in AcePack SMIT packages enhance power density appeared first on Softei.com – Global Electronics Industry News.

Read More
Softei.com – Global Electronics Industry News

Exit mobile version