Knowles Precision Devices blog article describes use of thin film technology on ceramic substratesfor interconnects and interposers. Innovation in advanced packaging was driven, in part, by advancements in interposer design and construction. Interposers are electronic components designed to sit within a package and connect different circuits and components via interconnects. Thin film interconnects are standard […]
Read the original post Leveraging Thin Film on Ceramic Substrates for Interconnects and Interposers on inter-connection blog.