Molex examines convergence of ruggedisation and miniaturisation in new report

Molex has released a report that explores the ever-increasing role of ruggedised, miniaturised interconnect solutions in unlocking new possibilities for electronic device innovation across a growing swath of industries. The report, entitled “Breaking Boundaries: Uniting Ruggedisation and Miniaturisation in Connector Design,” looks at the trends, tradeoffs and enabling technologies that remove roadblocks while helping shape […]

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