New models added to CUI Devices’ line of BGA heat sinks

CUI Devices’ Thermal Management Group has announced the expansion of its line of BGA heat sinks. Compatible with ball grid array (BGA) devices, the HSB family now offers aluminium or copper material options, clean or black anodised material finishes, and adhesive or PCB mounting styles. All BGA heat sink models are conveniently measured under four […]

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