September 2022

PCB Heat Management by SMD Thermal Conductors

This technical blog article written by Jern Ng, KYOCERA-AVX Components Corporation, explains benefits and use of SMD Thermal Conductors for PCB heat management. Introduction Efforts to miniaturize electronics are becoming increasingly common as […] Read the original post PCB Heat Management by SMD Thermal Conductors on Passive Components Blog.

PCB Heat Management by SMD Thermal Conductors Read More »

STS4xA temperature sensor includes on-board diagnosis

The STS4xA is a digital temperature sensor series specifically designed by Sensirion for automotive applications. The sensor series supports automated optical inspection and includes an on-board diagnosis system. The digital automotive sensor is available in two versions: STS41A-AD1B and STS41A-AW1B. The latter offers optional wettable flank packaging to support automated optical inspection (AOI). The integrated

STS4xA temperature sensor includes on-board diagnosis Read More »

Network synchronisation range has precision for 5G performance

According to Skyworks its portfolio of network synchronisation products for 5G networks allows mobile operators deploying 5G fronthaul equipment to offer next-generation mobile connectivity for customers.  The product family includes the Si551x and Si540x families of NetSync clock IC devices, which work with Skyworks’ AccuTime IEEE 1588 software. Each product family is tailored to suit

Network synchronisation range has precision for 5G performance Read More »

Automotive MCU supports CAN-XL comms

The Stellar P6 automotive MCU has been developed by STMicroelectronics is claimed to be the first to support new high data rate in-car communication protocol, the CAN-XL. As vehicles generate, process, and transfer large data flows, especially to support the next generation of EVs, the Stellar P automotive MCUs are believed to be the industry’s first qualifiable

Automotive MCU supports CAN-XL comms Read More »

Coilcraft Reduces DCR on its Ultra-Low Loss Power Chip Inductors by up to 30%

Coilcraft reduces DCR up to 30% on its popular XGL1060 series of ultra-low loss power chip inductors. XGL1060 molded power chip SMD inductors offer Coilcraft’s lowest DC losses and extremely […] Read the original post Coilcraft Reduces DCR on its Ultra-Low Loss Power Chip Inductors by up to 30% on Passive Components Blog.

Coilcraft Reduces DCR on its Ultra-Low Loss Power Chip Inductors by up to 30% Read More »

UP Bridge the Gap and Intel move into robotic dev kits

UP Bridge the Gap has partnered with Intel to release two robotic development kits, claimed to simplify robotics evaluation and development.  To address the challenges of developers such as selecting the right components, developing the robotics software, and integrating the software onto the robotics hardware, the UP Xtreme i11 and UP Squared 6000 offer an

UP Bridge the Gap and Intel move into robotic dev kits Read More »

Scroll to Top