Customer programme has panel fittings with a twist
FDB Panel Fittings has announced its Rocfast customer service programme and said it saves time, money and mistakes by guiding […]
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Infineon’s XENSIV Connected Sensor Kits, Now at Mouser, Offer Sensor Platform for IoT Device Development
The Infineon XENSIV™ connected sensor kits provide a ready-to-use sensor development platform for IoT devices. Read more published by Mouser
Mouser Tools Make It Easy to Find and Choose the Right Electronic Components
Mouser’s Help Center and Services & Tools allow customers to request data sheets, view and track existing orders, place new
Mouser Tools Make It Easy to Find and Choose the Right Electronic Components Read Post »
Seeed Studio ODYSSEY- X86J41258xx RP2040 Mini PCs
Seeed Studio ODYSSEY- X86J41258xx RP2040 Mini PCs feature Quad-core Intel® Celeron® J4125 and RP2040 co-processor. Available from Mouser Electronics Read more published
Seeed Studio ODYSSEY- X86J41258xx RP2040 Mini PCs Read Post »
TE Connectivity HCL Aluminum-Housed Resistors
TE Connectivity’s HCL Aluminum-Housed Resistors are designed in an ultra-slim package capable of dissipating high power where space is at
TE Connectivity HCL Aluminum-Housed Resistors Read Post »
Amphenol RF AUTOMATE Type A Mini-FAKRA Cable Assemblies
Amphenol RF AUTOMATE Type A Mini-FAKRA Cable Assemblies are designed on highly-flexible TFC-302LL cables and offer a DC to 9GHz frequency
Amphenol RF AUTOMATE Type A Mini-FAKRA Cable Assemblies Read Post »
4th PCNS Call for Abstracts
4th PCNS Passive Components Networking Symposium Calls for Abstracts. The event will be held on September 11th to 14th 2023
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How to Ensure Board-to-Board Connectors Meet High-Speed Automotive Assembly and Use Requirements
This article written by Steven Keeping, contributed By Digi-Key, discusses the key requirements for board-to-board connectors to meet high-speed automotive
CAP-XX Releases Ultra-Thin Supercapacitor for IoT and Battery-less Devices
CAP-XX, the leading manufacturer of ultra-thin prismatic, cylindrical, and Lithium-Ion supercapacitors, has launched its DMV750 ultra-thin 2.2mm prismatic 3V 750mF
CAP-XX Releases Ultra-Thin Supercapacitor for IoT and Battery-less Devices Read Post »
Qualcomm announces “first 5G Advanced-ready modem-RF system”
Claimed to be the first modem to antenna system to support 5G Advanced, Snapdragon X75 will push the boundaries of
Qualcomm announces “first 5G Advanced-ready modem-RF system” Read Post »