January 2024

Video — The Analog Devices MAXM17572 Himalaya uSLIC step-down power module is designed to enable cooler, smaller, and simpler power-supply solutions.

The ADI MAXM17572 features an integrated controller, MOSFETs, compensation components, and inductor, all within the uSLIC package. The use of ceramic capacitors further simplifies design and minimizes PCB footprint. The power module also is equipped with an array of protection functions, ensuring robust and reliable operation. Read more published by Mouser Electronics Inc..

Video — The Analog Devices MAXM17572 Himalaya uSLIC step-down power module is designed to enable cooler, smaller, and simpler power-supply solutions. Read More »

Rohm announces industry’s first speech synthesis ICs dedicated for acoustic vehicle alerting systems in xEVs

The ROHM group company LAPIS Technology has developed the industry’s first speech synthesis ICs – the ML22120xx series (ML22120TB, ML22120GP) – designed for AVAS in xEVs (electric vehicles). In order to achieve a carbon neutral (decarbonised) society, the number of hybrid and electric vehicles that silently operate on motor power continues to increase – prompting AVAS regulations to

Rohm announces industry’s first speech synthesis ICs dedicated for acoustic vehicle alerting systems in xEVs Read More »

Infineon launches next-generation ZVS flyback converter chipset for advanced USB-C PD adapters and chargers

The growing popularity of USB-C power delivery (PD) charging increases the demand for compatible chargers. Users now seek powerful yet compact adapters. Infineon addresses this need with the EZ-PD PAG2, a secondary-side controlled ZVS flyback converter chipset. This chipset, comprising EZ-PD PAG2P and EZ-PD PAG2S, integrates USB PD, a synchronous rectifier, and a PWM controller.

Infineon launches next-generation ZVS flyback converter chipset for advanced USB-C PD adapters and chargers Read More »

Portwell adds a new COM Express type 6 module with new gen Intel core ultra processors

Portwell has expanded its COM Express module product line with the PCOM-B65A. This module utilises the new generation Intel Core Ultra processor and is based on the COM Express Basic size form factor (125 mm x 95 mm), continuing the popular legacy of rich I/O interface solutions. To meet growing computing demands for optimised performance

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Top Connector Supplier Selection

Connector selection process among the top world suppliers is discussed in this articles written by Ron Bishop and published by TTI Market Eye. Design engineers and purchasing personnel strive to identify the best connector companies for their design and purchasing requirements. However, identifying the best companies is not an easy task. Answers to the following questions

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Novosense announces quad-channel digital isolators for industrial and automotive applications

Novosense Microelectronics has expanded its family of digital isolators with quad-channel devices that provide the performance and protection demanded by the latest industrial and automotive applications. The new NSI824xWx high-reliability digital isolators provide compact and efficient protection and level shifting in applications ranging from solar inverters and energy storage to industrial automation and electric vehicles.

Novosense announces quad-channel digital isolators for industrial and automotive applications Read More »

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