February 2024

How to Process Through-Hole Components by Reflow Assembly

/ Passives and Interconnect

This podcast by Würth Elektronik explains conditions and processes how to mount through-hole components by reflow. Because of fast assembling and small sizes, designers are turning to surfance mount technology on their PCBs. Although there are still through-hole (THT) components that need to be soldered by Wave, Through-Hole Reflow (THR), allows designers to solder the […]

How to Process Through-Hole Components by Reflow Assembly Read More »

Microchip’s low-cost PolarFire SoC discovery kit makes RISC-V and FPGA design more accessible

/ Industry

The embedded industry is seeing an increased demand for open-source RISC-V-based processor architectures, but there are still limited options when it comes to commercially available silicon or hardware. To fill this gap and help empower innovation, Microchip has launched the PolarFire SoC Discovery Kit. By offering a user-friendly, feature-rich development kit for embedded processing and

Microchip’s low-cost PolarFire SoC discovery kit makes RISC-V and FPGA design more accessible Read More »

ROHM’s new breakdown SBDs deliver industry-leading reverse recovery time

/ Industry

ROHM has developed 100V breakdown Schottky barrier diodes (SBDs) that deliver industry-leading reverse recovery time (trr) for power supply and protection circuits in automotive, industrial, and consumer applications. Although numerous types of diodes exist, highly efficient SBDs are increasingly being used inside a variety of applications. Particularly SBDs with a trench MOS structure that provide

ROHM’s new breakdown SBDs deliver industry-leading reverse recovery time Read More »

Farnell speeds test time-to-market with availability of NI LabVIEW+ Suite

/ Industry

Farnell has announced that it now stocks NI’s LabVIEW+ Suite, a software bundle comprised of LabVIEW plus, TestStand, DIAdem, and FlexLogger, purpose-built tools for measurement, analysis, and test designed to enable engineers to build better automated test systems, faster. LabVIEW has been NI’s benchmark software programme for 30 years, embraced by multiple generations of engineers

Farnell speeds test time-to-market with availability of NI LabVIEW+ Suite Read More »

R&S enables Qualcomm to pioneer new frequency ranges for future 5G-Advanced and 6G networks

/ Industry

In the evolving landscape of 5G networks, leveraging frequency ranges FR1 (0.41 to 7.125 GHz) and FR2 (24.25 to 71 GHz) has been pivotal. As the era of 5G-Advanced and 6G unfolds, a third frequency range is being discussed in global regulatory and industry consortiums worldwide. FR3, which is also known as upper-midband, spanning 7.125

R&S enables Qualcomm to pioneer new frequency ranges for future 5G-Advanced and 6G networks Read More »

Miniaturization of PCBs with Embedded Active and Passive Components; WE Webinar

/ Passives and Interconnect

This Würth Elektronik webinar dives into the fascinating world of miniaturization of printed circuit boards with embedded active and passive components. The efficient use of ever smaller housing volumes and tiny surfaces is becoming increasingly important. Embedding technology is the proven solution to these challenges. Find out more about the advantages and possibilities of embedding

Miniaturization of PCBs with Embedded Active and Passive Components; WE Webinar Read More »

PCB Based Power Distribution Units; WE Webinar

/ Passives and Interconnect

In this Würth Elektronik webinar you will learn more about PCB based power distribution units and the power connection possibilities. Practical examples will demonstrate challenges and solution of power distribution units using PCB platform. In the field of power electronics, there is always the fundamental question of how to get power to the PCB and

PCB Based Power Distribution Units; WE Webinar Read More »

Video — Microchip Technology’s Pressure Demo Kit, available at Mouser, demonstrates the AVR64DD32 ADC’s responsiveness as it lights up LEDs based on applied pressure.

/ Distributors

The Microchip Pressure Demo Kit can send the pressure reading via a UART interface that allows real-time observation of the pressure data locally. The AVR64DD32 is equipped with core-independent peripherals (CIPs) like ADC and UART functionalities. To ensure a seamless reading experience, the ADC internally employs a smart filtering technique, gathering 16 measurements and providing

Video — Microchip Technology’s Pressure Demo Kit, available at Mouser, demonstrates the AVR64DD32 ADC’s responsiveness as it lights up LEDs based on applied pressure. Read More »

Scroll to Top