February 2024

Infineon introduces lower cost Bluetooth long-range module for low power applications

Infineon has announced the CYW20822-P4TAI040, its latest Bluetooth module that pushes the low-power and range boundaries for wireless connectivity in IoT and consumer electronics. This module offers seamless integration, enhanced performance with Bluetooth low-energy long-range (LE-LR) support, and exceptional reliability for a wide range of applications. With the right combination of low power and high

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Renesas to acquire Altium to make electronics design accessible to broader market and accelerate innovation

Renesas and Altium have announced they have entered into a Scheme Implementation Agreement (“SIA”) for Renesas to acquire Altium by way of a Scheme of Arrangement under Australian law (“Scheme”). Under the terms of the transaction, subject to satisfaction of a number of conditions, Renesas will acquire all outstanding shares of Altium for a cash

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Industry’s first Grandmaster to provide high-speed network interfaces up to 25 Gbps

The operators of critical infrastructure market segments such as 5G telecommunications, power utilities and transportation need to continuously upgrade their networks with technology capable of delivering higher processing speeds and highly accurate time sources that are not dependent on the Global Navigation Satellite System (GNSS) constellations like GPS, GALILEO and QZSS. To provide network operators

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Samtec introduces 0.635 mm pitch, slim body edge rate connectors

Samtec has expanded its successful line of Edge Rate board-to-board connectors to include a higher density mated set that is half the width of previous designs and offers a lower-profile 5 mm mated height (ERF6 & ERM6 Series). ERF6 & ERM6 Series Edge Rate® connectors support 56 Gbps PAM4 high-speed, rugged mezzanine applications for industrial,

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Rohde & Schwarz collaborates with Sony Semiconductor to reach milestones for NTN NB-IoT roll-out

In collaboration with Sony, Rohde & Schwarz has successfully validated and verified Sony’s Altair device for its NTN NB-IoT capability. Using the advanced R&S CMW500 mobile radio tester platform from Rohde & Schwarz, Sony was able to verify all 3GPP defined RF parameters on their chipset in an interactive testing mode, in both geostationary orbit

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Nexperia now offers automotive planar Schottky diodes in space-saving CFP3-HP packaging

Nexperia, has announced that it is now offering a portfolio of 22 new planar Schottky diodes in CFP3-HP packaging. The portfolio includes 11 industrial, as well as 11 AEC-Q101 qualified products. This release supports the growing trend for manufacturers to replace devices in SMx-type packaging with smaller footprint CFP-packaged devices, especially in automotive applications. These

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