To support the quest for improved performance and power density, Infineon Technologies has launched a Source-Down 3.3 x 3.3mm² PQFN product with bottom-side cooling (BSC) and dual-side cooling (DSC) variants. The power MOSFETs are intended for DC/DC power conversion in server, telecomms, OR-ing, battery protection, power tools and charger applications. For the Source-Down (SD) package, the MOSFET die source […]
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