Insights on Passive Electronic Components

Electronics Supply Chain Weekly Digest 12-19-25. DATAPOINT OF THE WEEK: S&P December Flash Eurozone mfg PMI decreased to 49.2 from […]

Bourns has released the BTJ Series thermal jumper chips, a family of surface‑mount thermal links designed to move heat efficiently

This article and presentation by Sam Ben-Yaakov describes one-pulse nonlinear-inductor measurement method that provides a compact way to extract nonlinear

Samsung Electro-Mechanics has introduced the world’s first CLLC resonant multilayer ceramic capacitor (MLCC) in a compact 1210 (3.2 × 2.5

Bourns® introduced PF-SRC50E fuse series offering a compact high-voltage protection solution that complies with UL 248-13 and IEC 60269-4 (aR

As AI servers and GPU accelerators push to higher performance and power density, their power delivery networks are undergoing a

According to article by Wu et al. from YAGEO researcher team in the International Journal of Applied Ceramic Technology, alloying nickel

Littelfuse releases a new family of six open-loop hall-effect current sensors that delivers accurate, isolated current measurement with analog or

Vishay Intertechnology, Inc. introduced two new series of thin film chip fuses with fast and very fast acting performance. The

This article by Vladimir Azbel, an independent consultant on tantalum capacitors, discusses a mechanical testing method for distinguishing load-bearing necks