This paper Stress Testing of Chip Aluminum Polymer Capacitors was authored by Alexander Teverovsky Jacobs Technology Inc., NASA/GSFC and presented by Jay […]
Stress Testing Evaluation of Chip Aluminum Polymer Capacitors for Space Applications Read Post »
This paper on 70GHz high frequency behavior of chip thin film resistors following AEC-Q200 qualification tests was presented by Benjamin
Characterization of 70GHz Thin Film Chip Resistors Read Post »
This paper 3D printing of passive electronic components from the perspective of a components manufacturer was presented by Johann Pichler,
3D Printing of Passive Components from Manufacturer Perspective Read Post »
This article provides an overview of EMC requirements and the associated issues for the housing and the system. The post
Housing EMC Requirements, Issues and Solutions Read Post »
Hirose introduces FH81 series with one action and top & bottom contact connectors that improve design flexibility and workability in
Hirose Introduces One Action Top and Bottom Contact Connectors Read Post »
Stackpole Electronics announces the addition of a 0.2 milliohm value to its 3-watt rated CSNL2512 current sense resistor. This new
Stackpole Expands 3 Watt Current Sense Resistor with 0.2 mOhm Value Read Post »
This article published in Nature Communications Journal discusses advancements in high-frequency capacitors development by combining EDLC supercapacitors with electrolytic capacitors,
Bourns Magnetics product line is pleased to introduce the AEC-Q200 compliant, automotive grade 1kV model SM91574AL BMS signal transformer. This single
Bourns Unveils Automotive 1kV BMS Signal Transformer Read Post »
This paper on new fast lock RF interface was presented by Olivier Berenfeld, Radiall SA, France during the 5th Space
This paper on novel high energy graphene material for supercapacitors was presented by Tomas Zednicek, EPCI European Passive Components Institute during
