Alphawave launches industry’s First 3nm UCIe IP with TSMC CoWoS packaging
Alphawave Semi has launched the industry’s first 3nm successful silicon bring-up of Universal Chiplet Interconnect Express (UCIe) Die-to-Die (D2D) IP […]
Alphawave launches industry’s First 3nm UCIe IP with TSMC CoWoS packaging Read Post »