CAP-XX Filed Supercapacitor Patents on SMT Packaging and Innovative Polymer Binder System 

CAP-XX Filed Supercapacitor Patents on SMT Packaging and Innovative Polymer Binder System 

CAP-XX has successfully filed two international patent applications, strengthening its patent protection for its supercapacitor technology in over 150 countries.

The first new international patent CAP-XX has secured will provide market protection for the company’s new cylindrical surface mount technology (SMT), which has the potential to revolutionize the way supercapacitors are mounted to printed circuit boards.

CAP-XX has developed unique combinations of supercapacitor materials with SMT packaging that can withstand the high temperatures experienced in a reflow oven. The energy and power density of these new SMT supercapacitors are comparable to standard non-reflowable products used on today’s market.

CAP-XX’s second new international patent relates to an innovative polymer system that binds together the active materials used in supercapacitors. The new binder system demonstrates excellent high-temperature stability, solid electrode processability, and superior final device electrical performance.

Notably, the binder technology, used exclusively with aqueous electrode slurries, improves the environmental attributes of the organic solvents typically used in electrode manufacture. Apart from standard electric double-layer supercapacitor electrodes, the binder system developed by CAP-XX could also be applied to manufacture battery electrodes.

Commenting on the company’s new patents, Lars Stegmann, CEO of CAP-XX, said:

“I’m thrilled that we’ve been able to reinforce our intellectual property portfolio and secure global protection for these new technologies. We plan to deliver our new SMT products in tape and reel packaging to allow and support our customers in producing them in high volumes. Meanwhile, we’ve already passed all the required feasibility testing on a production coating line for our new polymer system.”

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