From Boom to Glut: Managing Excess Electronics
What used to be pervasive discourse about electronics shortages and disruptions is now about excess inventory and burn-off. The post […]
From Boom to Glut: Managing Excess Electronics Read Post »
Infineon offers CoolSiC in 62mm package
Infineon has expanded its CoolSiC 1200V and 2000V MOSFET module families with a new industry standard package. The 62mm device
Infineon offers CoolSiC in 62mm package Read Post »
Long range microcontrollers simplify wireless design for smart buildings
Wireless device design expertise gained by STMicroelectronics is combined with its STM32 architecture in the new STM32 SoC which has
Long range microcontrollers simplify wireless design for smart buildings Read Post »
21-slot hybrid PXIe chassis is in compact 4U form factor
A 42-927 PXIe chassis offers 20 hybrid peripheral slots and is the latest addition to Pickering Interfaces’ PXIe chassis range.
21-slot hybrid PXIe chassis is in compact 4U form factor Read Post »
ClickID opens up possibility of Linux development growth
A hardware/software open source solution, ClickID has been announced by MikroElektronika. It enables many hundreds of Click boards to be
ClickID opens up possibility of Linux development growth Read Post »
ITEC claims latest RFID inlay die bonder is fastest and most accurate yet
According to ITEC, its ADAT3 XF Tagliner is the industry’s fastest and most accurate RFID inlay die bonder. It has
ITEC claims latest RFID inlay die bonder is fastest and most accurate yet Read Post »
TTI Names Kerr VP for Product Management
TTI, Inc., a leading specialty distributor of electronic components, announced today the creation of the new key leadership role of
TTI Names Kerr VP for Product Management Read Post »
Leuze to Open Facility in Georgia
Duluth in the northeast of Atlanta, Georgia, will in the future be the new Leuze location in the USA. “After
Leuze to Open Facility in Georgia Read Post »
The U.S.-China Chip War: What it Means for You
Anyone relying on the chip market – or operating in neighboring markets – will know how disruptive the first half
The U.S.-China Chip War: What it Means for You Read Post »
Parker Chromerics releases its lowest durometer fluorosilicone-based material
Cho-Seal 6750 is the latest EMI shielding material with “excellent environmental sealing” said the Chomerics division of Parker Hannifin. It
Parker Chromerics releases its lowest durometer fluorosilicone-based material Read Post »