Industry

u-blox has announced that Move-X has chosen to integrate u-blox positioning technology and u-blox cloud positioning service in their new LoRa connectivity solution – the Cicerone board. Cicerone board leverages u-blox CloudLocate service On the move and in the field, asset tracking IoT devices need to be ultra-low-power. Move-X’s new Cicerone board gives asset tracking […]

Siemens Digital Industries Software has collaborated with semiconductor foundry United Microelectronics (UMC) to develop and implement a multi-chip 3D IC planning, assembly validation and parasitic extraction (PEX) workflow for the foundry’s wafer-on-wafer and chip-on-wafer technologies.  Stacking silicon die or chiplets on top of each other in a single packaged device allows companies to achieve the

Snapdragon W5+ Gen 1 and Snapdragon W5 Gen 1 platforms developed by Qualcomm extend battery life in wearable devices, said the company. They are designed for low power operation in connected wearable devices with a focus on extended battery life and sleek designs. Manufacturers can scale, differentiate and develop products faster using these platforms, confirmed

Designed to be easy to use, intuitively pluggable and safe, the 570 series easy locking connector (ELC) from binder is recommended for sensitive homecare applications. It has been engineered to be robust and bio-compatible and meets the requirements for electromechanical connectivity in medical devices. The 570 series cable connector features snap-in locking and an asymmetric

Israeli vision on chip processor specialist, Intuitive has added the NU4100 IC to its Vision and AI IC portfolio. The company said it has created a new industry standard by combining integrated dual-channel 4K ISP with enhanced AI performance coupled with depth sensing and VSLAM capabilities. The NU4100 is based on the company’s 12nm process

At this week’s ECOC (European Conference on Optical Communication) in Basel, Switzerland, Keysight and Synopsys demonstrated the industry’s first common electrical interface (CEI) SoC supporting 224Gbits per second. To accelerate 1.6Tbit per second transceiver designs and pathfinding, Keysight Technologies has introduced 224G Ethernet test products which enable SoC makers to validate next-generation electrical interface technology,

For switching in battery management systems (BMS) in storage systems, charging stations, and high voltage measurement and infrastructure control applications, Panasonic Industry Europe has released the AQV258H5 PhotoMOS HE relay. The relay series offers 5kV I/O isolation and an increased clearance and creepage distance on output side. It is supplied in a miniature 1-Form-A DIP5

Two PFC (power factor correction) boost controllers, the L4985A / L4985B and L4986A / L4986B, integrate 800V start up circuitry to simplify design and enhance flexibility, said ST Microelectronics.   The built-in high-voltage start up capability saves auxiliary circuitry, allowing a ’no aux’ design that reduces bill of materials costs and is ensures reliable starting. These circuits also

While DC/DC converters are ubiquitous, the thermal management may vary according to power density and efficiency. Fischer Elektronik has announced heatsink solutions in the SK DC 15, SK DC 16, SK DC 17, SK DC 18 and SK DC 19 series specifically for reliable heat dissipation for DC/DC converters in the 1/8-brick format.  The five

At EuMW (European Microwave Week) Rohde & Schwarz will present a signal generation and analyser for measurements in the D band that, the company said will “significantly simplify early next generation mobile communications research”. The The R&S FE170ST (single transmit) and R&S FE170SR (single receive) front end extensions are easy to mount to, and configure with,