Industry

Claimed to be the first pluggable module for co-packaged optics, the External Laser Source Interconnect System (ELSIS) will be launched by Molex at ECOC 2022. The system of cage, optical and electrical connectors with a pluggable module uses proven technology to speed the development of hyperscale data centres, said the company. Molex is currently sampling […]

TRUMPF Photonic Components and KDPOF working together for new wavelength standards in optical data communication within the automotive branch // Optical interconnects to become an indispensable part in future cars // The target is to bring to the market an integrated transceiver for multi-gigabit optical communications into automobile // 980nm wavelength VCSELs for greater robustness

Three PCB relays from Omron Electronic Components Europe are compact for use in automotive and mobility applications. The Omron G8K, G8G and G8PM relays support high performance DC motor control with a floor size and volume that is up to 95 per cent smaller than similar relays on the market, said the company. They are

To protect computing, docking and adapters, Halo Microelectronics’ latest release is the HL8261, a four-channel USB Type-C port protector IC. Today, sideband use (SBU) channels can carry high speed data, which complicates protecting the SBU pins from electrostatic discharge (ESD) because the mechanism used to shield the pins adds capacitance to the SBU channels, therefore

Two STPower modules that contain 1200V SiC MOSFETs in popular configurations and based on AcePack 2 package technology to ensure high power density and simplified assembly, claimed STMicroelectronics. The A2F12M12W2-F1, is a four-pack module that provides a compact full-bridge solution for circuits such as DC/DC converters and the A2U12M12W2-F2, employs a three-level T-type topology to

Magnachip Semiconductor has introduced three 200V MV MOSFETs, suited for LEV motor controllers (such as those for e-bikes) and industrial power supplies.  The MDT20N109PTRH, the MDY20N113PTRH and the MDP20N116PTTH 200V MOSFETs are based on Magnachip’s third generation trench MOSFET technology. The capacitance MDT20N109PTRH has been reduced by 50 per cent compared to the previous generation

The Avnet (Nasdaq: AVT) Board of Directors (BOD) voted to officially appoint Ken A. Jacobson as the Company’s Chief Financial Officer (CFO) reporting to Avnet’s Chief Executive Officer Phil Gallagher. Jacobson, age 44, joined Avnet in 2013 as Vice President and Corporate Controller and served as Avnet’s interim CFO in 2017-2018. As corporate controller, Jacobson had…

A multi-protocol wireless connectivity module developed by Telink and Nowi is an energy autonomous wireless connectivity module claimed to enable additional energy harvesting use-cases by reducing BoM (bill of material), size, cost and complexity. The TLSR8273-M-EH- combines Telink’s multi-protocol connectivity SoC with Nowi’s energy harvesting power management IC (PMIC). It provides low power wireless connectivity,

The spinout from the Power Electronics, Machines and Control Group at the University of Nottingham, TPPi, will launch the UltraMod4000 converter in a package at LCV-Cenex (UTAC Millbrook, UK on 7 and 8 September). Available from distributor PPM Power, the UltraMod range is a family of GaN-based, multi-purpose, bi-directional, isolated, DC/DC converters. They are designed to