Smith Launches Online Marketplace
Smith, a leading global distributor of electronic components and semiconductors, today announces the launch of its online marketplace, SmithTrade™. This flexible […]
Smith Launches Online Marketplace Read Post »
Buyers: Let the Good Times Roll…But Stay Alert
Finally, the electronics market has shifted from stretching lead times and uncertainty to what can only be called a buyers’
Buyers: Let the Good Times Roll…But Stay Alert Read Post »
EMITE and R&S join forces to support OTA measurements on Wi-Fi 7 and 5G RedCap
EMITE’s over-the-air chambers can now be combined with the latest testing features of the R&S CMX500 one-box signalling tester from
EMITE and R&S join forces to support OTA measurements on Wi-Fi 7 and 5G RedCap Read Post »
Free samples of every STMicroelectronics NPI IC available from Anglia
Anglia Components has announced a commitment to ship sample quantities of every STMicroelectronics (ST) semiconductor NPI (New Product Introduction) free
Free samples of every STMicroelectronics NPI IC available from Anglia Read Post »
Evaluation bundle from HighTec provides simplicity to manage AUTOSAR complexity
HighTec EDV-Systeme GmbH, in collaboration with Infineon Technologies AG, has announced the release of the AURIX TC4x MCAL Evaluation Bundle.
Evaluation bundle from HighTec provides simplicity to manage AUTOSAR complexity Read Post »
Simple integration of ODU AMC T series thanks to new receptacles
The new ODU AMC Series T square flange receptacles have a rectangular flange that complies with the cut-out dim. according
Simple integration of ODU AMC T series thanks to new receptacles Read Post »
Dentressangle to Acquire ASIC Maker Presto Engineering
Dentressangle Capital has entered exclusive talks to acquire Presto Engineering, a company specializing in designing and producing application-specific integrated circuits
Dentressangle to Acquire ASIC Maker Presto Engineering Read Post »
U.S. -Japan Packaging Venture Launched
Resonac Corporation today unveiled a new consortium of ten partners, called “US-JOINT,” for its semiconductor back-end process R&D in Silicon
U.S. -Japan Packaging Venture Launched Read Post »
Eco-Counter selects Insight SiP Bluetooth Module for people and vehicle counting applications for Smart Cities
Eco-Counter has selected Insight SiP’s ultra-miniature RF Bluetooth module for its EVO family of counting devices. Eco-Counter is an provider
ST BrightSense image sensor ecosystem for advanced camera performance
ST has introduced a set of plug-and-play hardware kits, evaluation camera modules and software that ease development with its ST
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