Industry

NXP embraces EU’s IPCEI ME/CT to expand research and development 

NXP Semiconductors have announced it is strengthening its European research and development (R&D) through grants to be provided via the 2nd Important Project of Common European Interest on Microelectronics and Communication Technologies (IPCEI ME/CT), with the final investment decision pending confirmation of the level of public funding. Dedicated NXP teams across Austria, Germany, the Netherlands […]

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OrCAD X accelerates PCB design using generative AI

Generative AI automation has been employed by Cadence Design System in the OrCAD X, cloud-enabled system design tool to reduce placement time from days to minutes, said the company. It streamlines the system design process and empowers designers through cloud scalability and AI-powered placement automation technology, enabling up to 5X reduction in design turnaround time,

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NeoMesh protocol stack allows for sensor integration, says NeoCortec

The latest version (1.6) of the NeoMesh protocol stack firmware is now available for NeoCortec’s NC2400 and NC1000 modules. The protocol stack is designed for easy integration of Sensirion SHT4xA sensors in order to build cost-effective, low power wireless temperature and humidity sensors, said NeoCortec. The firmware of the NC2400 and NC1000 modules already includes

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Six temperature monitoring ICs extend Thermoflagger range

Toshiba Electronic Europe has added six temperature monitoring ICs bringing the total number of Thermoflagger over-temperature detection ICs to eight.  The ICs detect temperature increases in electronic devices to ensure safety in mobile devices, home appliances and industrial equipment. The TCTH011AE, TCTH012AE, TCTH021AE, TCTH022AE, TCTH011BE and TCTH012BE complement the existing TCTH021BE and TCTH022BE Thermoflagger ICs.

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VIAVI and partners awarded funding for three projects In DSIT ONE competition

Viavi Solutions Inc. have announced that the company is part of three consortia that have won funding in the Open Networks Ecosystem (ONE) competition sponsored by the U.K. Department of Science, Innovation and Technology (DSIT). VIAVI and partners submitted successful bids for HiPer-RAN led by University of Surrey, REACH led by University of York, and

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Graphene Flagship’s innovations in automotive technology accelerate green mobility

The Graphene Flagship, an ambitious European research initiative launched in 2013, has made significant progress in advancing graphene-based innovations for automotive in the last ten years. The project examines how graphene, with its valuable properties, is addressing key challenges in the automotive sector, such as fuel efficiency, recycling, and environmental impact. Here, Ali Shaygan Nia,

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Waldom Partners With Kyocera AVX

Waldom Electronics, Inc. added KYOCERA AVX to its Manufacturer Line Card by participating in Waldom’s Excess Management Solution. This partnership will provide opportunities to service KYOCERA AVX’s global authorized distributors in a sustainable manner by providing in-stock inventory at reduced Minimum Order Quantity (MOQ) investments and distribution costs while reducing their risk of excess inventory.…

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HighTec announces agreement with Synopsys on distribution of Synopsys ARC® MetaWare development toolkit for Infineon AURIX TC4x

HighTec EDV Systeme GmbH is further expanding its support for Infineon AURIX TC4x through a distribution and support agreement with Synopsys. HighTec can now offer its development platform for AURIX together with the Synopsys ARC® MetaWare Development Toolkit for AURIX™ TC4x as an optimised complete solution for Infineon AURIX TC4x. Both compiler tools, from Synopsys and from

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