Passives and Interconnect

Molex announces agreement to acquire Smiths Interconnect, enhancing its position in aerospace and Defense. Molex, a leading global electronics connectivity […]

Murata Manufacturing Co., Ltd. announces a significant collaboration with Cadence Design Systems, Inc., making product libraries directly accessible within Cadence’s

The ECIA survey results for September 2025 pulse sales sentiment results reveal a persistent and optimistic outlook in the sales industry.

Stackpole Electronics, Inc. has unveiled its latest RMWA series of thick film chip resistors, meticulously engineered to deliver exceptional power

Electronics Supply Chain Weekly Digest 10-17-25. DATAPOINT OF THE WEEK: Passenger car retail sales in China reached 2.241M in September,

Bourns® CSS4C-1216 Series delivers superior current sensing accuracy in a compact, robust design ideal for high-performance and high-reliability applications. Bourns,

To meet the growing demand for high performance electronic components in next-generation automotive applications, Vishay Intertechnology, Inc. introduced a new

Bourns high inductance common mode choke is constructed with a ferrite core for low radiation to deliver superior EMI suppression.

The new KGP Series commercial-grade stacked MLCCs are engineered to optimize the performance of high-frequency applications in the industrial, alternative

Bourns Introduces the HCTSM150102HLF-E: A High-Performance High Clearance/Creepage Distance Isolation Power Transformer for ESS and High Voltage/Current Meter Applications. Bourns,