Passives and Interconnect

In this video prof Sam Ben-Yaakov introduces a comprehensive user-friendly simulation model of MLCC ceramic capacitors. Class II MLCC ceramic […]

This blog post was written by Philip Lessner, Chief Technology Officer at YAGEO Group and posted on his LinkedIn profile

ESA ESTEC is pleased to announce online program and registration of the 5th edition of the Space Passive Component Days (SPCD)

Exxelia, global manufacturer of complex passive components and subsystems introduces groundbreaking innovations in smart magnetics technology, specifically tailored for resonant

Application of Johnson’s approximation in finite element modeling for electric field-dependent materials give improved understanding of voltage dependence and provide

HARTING, a global leader in connector and interconnect technology partnered with Altium unlock the full potential of 3D-Circuits PCB design.

In this Würth Elektronik webinar we will offer you insights into HDI PCBs for Harsh Environments: What influences does a

This video by Robert Feranec hosts Thomas Eichstetter to go step by step measuring and fixing EMC problem of a

LS Materials announced launch of the world’s first “cell-module integrated” supercapacitor (SC) named CellDule, marking a significant advancement in energy

TAIYO YUDEN CO., LTD. has commercialized four items, including the high temperature multilayer metal power inductor MCOIL™, which complies with