Passives and Interconnect

The paper “Tantalum Capacitor Technology Advantages for Harsh Environment” was presented by Michel Bouvier, Vishay Europe, Le Pecq, France at the […]

The paper “Thermoset Polymer Dielectric Capacitors for Harsh Environment Applications ” was presented by Angelo Yializis, PolyCharge America Inc. Tucson, AZ,

This article based on TDK blog article discus a technical perspective of EMI electromagnetic noise mitigation in automotive 48v power

Bourns has introduced a compact common mode choke series with an extended current capability of up to 15 A and

Vishay Intertechnology, Inc. announced that its Vishay Ametherm SL2220007 big AMP inrush current limiting negative temperature coefficient NTC thermistor has received UL

Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, added a new common mode chip

The paper “Computer Vision‑Driven Verification of Passive Component Assembly on Space‑Grade PCBs” was presented by Carmen Galán,  and Manuel Domínguez, ALTER Technology, Seville, Spain

The paper “AI Hardware Development and Its Consequences for Passive Electronic Components” was presented by Tomas Zednicek, EPCI European Passive Components

The paper “Passive Components in AI Systems” was presented by Slavomir Pala, KYOCERA AVX Lanskroun, Czech Republic at the 5th PCNS Passive

Bourns releases automotive grade, AEC-Q200 compliant SDE0403AT SMD power inductor series with higher current density, high saturation current and low-profile