Passives and Interconnect

This video presentation from Würth Elektronik discusses the next generation of self-heating definition using IEC standards: Performance Rated Current. Currently […]

April 2024 component distribution insights by Edgewater Research shows uptick in interconnection and passives electronic components (IP&E) month to month, semiconductors

Although standard products from the binder portfolio suit most applications, they do not fit all of them. In such cases,

Researchers from the University of Houston, Jackson State University and Howard University have developed a new type of flexible high-energy-density

Korea Advanced Institute of Science and Technology (KAIST) announced that a research team led by Professor Jeung Ku Kang from the Department

KYOCERA AVX TWA M39006 Series axial-leaded, hermetically sealed wet tantalum capacitors deliver high-reliability, high-CV performance in harsh environment military, defense,

Murata Manufacturing Co., Ltd. has developed an SMD type NTC thermistor capable of both high-precision temperature measurement at high temperatures

TDK Corporation announces the new EPCOS B43659 series of compact general-purpose snap-in aluminum electrolytic capacitors. This is the next generation

This Würth Elektronik webinar dig into details of signal integrity issues and challenges of base connectors. ZIF board to board

Traditional Spacers are commonly used in electronic assemblies – but they require a lot to manual effort. WE show a