Passives and Interconnect

This paper on Development Of Highly Integrated W-Band Circulators/Isolators Based On Substrate Integrated Waveguide (SIW) Technology was presented by Henrik […]

This paper MINCOR – Minimization Of Crystal Oscillator Cosmic Radiation Effects  was prepared by Nicolas GUFFLET, Laurent COUTELEAU, Frederic VITTRANT

This paper CAD-to-FAB: an introduction to the recent and ongoing investment in the capability to produce, at scale a variety

Würth Elektronik is excited to announce the launch of the SN6507 Development Kit [756507], featuring the Texas Instruments (TI) SN6507EVM

Bourns adds four product series to its shielded power inductor portfolio. The new power inductors feature high heating/saturation current and

This paper on 70GHz high frequency behavior of chip thin film resistors following AEC-Q200 qualification tests was presented by Benjamin

This paper Stress Testing of Chip Aluminum Polymer Capacitors was authored by Alexander Teverovsky Jacobs Technology Inc., NASA/GSFC and presented by Jay

This paper 3D printing of passive electronic components from the perspective of a components manufacturer was presented by Johann Pichler,

This article provides an overview of EMC requirements and the associated issues for the housing and the system. The post

Bourns Magnetics product line is pleased to introduce the AEC-Q200 compliant, automotive grade 1kV model SM91574AL BMS signal transformer. This single