Dispensable gel that “excels in thin bond line applications” has been released by Parker Chomerics. The Therm-A-Gap Gel 50TBL is a new thermal interface material for use in very thin bond. It offers 5W/m-K bulk thermal conductivity. At a minimum bond line thickness of 0.05 mm, the apparent thermal conductivity exceeds 10 W/m-K. The Therm-A-Gap […]
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