How to Process Through-Hole Components by Reflow Assembly

How to Process Through-Hole Components by Reflow Assembly
How to Process Through-Hole Components by Reflow Assembly

This podcast by Würth Elektronik explains conditions and processes how to mount through-hole components by reflow. Because of fast assembling and small sizes, designers are turning to surfance mount technology on their PCBs. Although there are still through-hole (THT) components that need to be soldered by Wave, Through-Hole Reflow (THR), allows designers to solder the […]

Read the original post at How to Process Through-Hole Components by Reflow Assembly

Scroll to Top