Infineon and Stellantis agree on Memorandum of Understanding on multi-year delivery of silicon carbide (SiC) chips

Infineon and Stellantis agree on Memorandum of Understanding on multi-year delivery of silicon carbide (SiC) chips

Infineon and Stellantis agree on Memorandum of Understanding on multi-year delivery of silicon carbide (SiC) chips

Infineon Technologies and the global automaker Stellantis have signed a non-binding Memorandum of Understanding as a first step towards a potential multi-year supply cooperation for silicon carbide (SiC) semiconductors. Infineon would reserve manufacturing capacity and supply CoolSiC™ “bare die” chips in the second half of the decade to the direct Tier 1 suppliers of Stellantis. […]

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