According to ITEC, its ADAT3 XF Tagliner is the industry’s fastest and most accurate RFID inlay die bonder. It has placement speeds of up to 48,000 units per hour (UPH), with positional and rotational accuracies better than nine microns and 0.67 degrees at one sigma. It is three times faster and 30 per cent more […]
The post ITEC claims latest RFID inlay die bonder is fastest and most accurate yet appeared first on Softei.com – Global Electronics Industry News.
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