Packaged GaN FETs are in thermally enhanced QFN packages

A packaged GaN FET that is footprint compatible with a previous EPC GaN FET, allowing engineers to make choices to trade off RDS(on) versus price to optimise the design for efficiency or cost by replacing either part number in the same PCB footprint. The 100V, 3.8 mOhm EPC2306 GaN FET offers high performance and a […]

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