Press-fit terminal power modules for a solder-free solution in high-volume manufacturing

The E-Mobility, sustainability and data centre markets require products that are conducive to high-volume manufacturing. To better automate the installation process, Press-Fit terminals are often used because they offer a solder-free solution to mount power modules to the PCB. Microchip Technology has announced its expansive portfolio of SP1F and SP3F power modules are now available […]

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