Norwegian chip company, TouchNetix has introduced ball grid array (BGA) packaging for its largest aXiom chip, the AX198A. The reduced footprint of the BGA package allows for smaller PCBs which reduces cost and overall size, added the company. This package is specially designed for industrial customers and human machine interfaces. The AX198A chip supports screen […]
The post TouchNetix introduces BGA packaging for aXiom chip appeared first on Softei.com – Global Electronics Industry News.
Read More
Softei.com – Global Electronics Industry News
