U.S. -Japan Packaging Venture Launched

U.S. -Japan Packaging Venture Launched
U.S. -Japan Packaging Venture Launched

Resonac Corporation today unveiled a new consortium of ten partners, called “US-JOINT,” for its semiconductor back-end process R&D in Silicon Valley. The ten American and Japanese semiconductor materials and equipment companies are: Azimuth; KLA; Kulicke & Soffa; Moses Lake Industries; MEC; ULVAC; NAMICS; TOK; TOWA; and Resonac. US-JOINT expands the activities of Japan-based open consortiums…

The post U.S. -Japan Packaging Venture Launched appeared first on EPS News.

Read More
EPS News

Scroll to Top