January 2024

January 24 – Interconnect, Passives & Electromechanical Components Market Insights

January 2024 collection of news summaries, survey results and channel market insights on Interconnect, Passives & Electromechanical Components from Edgewater Research. What’s Changed/What’s New?1. Auto outlook in the West more mixed on slowdown in EVs but better than semis at +MSD on limited pockets of inventory.2. CY24 China Auto demand feedback constructive, projected up HSD on […]

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CMSE Components for Military & Space Electronics 2024 Call for Presentations

The 27th Annual CMSE Conference and Exhibition is accepting presentations for April 30th -May 2nd 2024 event in Los Angeles. Deadline for presentation abstracts have been extended to February 14th 2024. Components for Military & Space Electronics Conference and Exhibition (CMSE) is the premier event focused on the design, reliability, and application of electronic components for use

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Custom Magnetic Design Process Flow

This article is based on newsletter blog written by Sotiris Zorbas, MSc Power Εlectronics Εngineer of Frenetic that explore the basic aspects of a custom magnetic design process flow that an engineer should possess before starting a custom design inquiry.   Basic Specs to Start with In order to make custom magnetic samples and move to production, there are certain

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Elohim and Daeduck Electronics Achieve Milestone in Embedded Silicon Capacitor Integration

Elohim Inc., a leading innovator in embedded silicon capacitor technology, proudly announces a transformative collaboration with Daeduck Electronics, an esteemed player in the semiconductor packaging industry. The latest development sees Elohim’s silicon capacitors embedded within Daeduck’s cutting-edge FCBGA substrate product, setting the stage for groundbreaking applications and future advancements. Daeduck Electronics conducted thorough reliability verification

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Siemens brings secure thermal digital twin technology to the electronics supply chain

Siemens Digital Industries Software has announced that it is bringing an innovative approach for sharing accurate thermal models of integrated circuit (IC) packages to the electronics supply chain. The main advantages are protecting intellectual property, enhancing supply chain collaboration and accuracy of models for steady state and transient thermal analysis to enhance design studies. Introduced

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21.5-inch Full HD TFT display features high brightness specification

Review Display Systems (RDS) has announced the introduction of a new 21.5-inch TFT display module from industrial display manufacturer, Chefree Technology Corporation. The C23061500501-215H features Full HD resolution (1920 x 1080 pixels), a 16:9 wide aspect ratio, and vertical alignment (VA) mode display technology which ensures excellent optical performance and wide viewing angles. The 21.5-inch

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Compact high-performance embedded computer for kiosk and robotics applications

ARK-3533 is powered by 12th and 13th Gen Intel Core i3/i5/i7/i9 35W desktop processors, offering desktop-comparable computing power in a form factor one-tenth the size (200 x 75 x 215 mm / 7.87 x 2.95 x 8.46 in) of an ATX tower. ARK-3533 supports 9~36 VDC power input and has a shock-resistant design that can

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Vector introduces high availability embedded software enabling dependable automated driving

Vector now offers embedded software for ECUs that meets the highest safety requirements according to ISO 26262. The software ensures reliable operation and is therefore particularly suitable for autonomous driving and x-by-wire systems. The new software is available for Vector’s MICROSAR Classic embedded software product. Vector’s new high-availability embedded software enables the development of safety-related

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