Siemens Digital Industries Software has collaborated with semiconductor foundry United Microelectronics (UMC) to develop and implement a multi-chip 3D IC planning, assembly validation and parasitic extraction (PEX) workflow for the foundry’s wafer-on-wafer and chip-on-wafer technologies. Stacking silicon die or chiplets on top of each other in a single packaged device allows companies to achieve the […]
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