Industry

A multi-protocol wireless connectivity module developed by Telink and Nowi is an energy autonomous wireless connectivity module claimed to enable additional energy harvesting use-cases by reducing BoM (bill of material), size, cost and complexity. The TLSR8273-M-EH- combines Telink’s multi-protocol connectivity SoC with Nowi’s energy harvesting power management IC (PMIC). It provides low power wireless connectivity, […]

The spinout from the Power Electronics, Machines and Control Group at the University of Nottingham, TPPi, will launch the UltraMod4000 converter in a package at LCV-Cenex (UTAC Millbrook, UK on 7 and 8 September). Available from distributor PPM Power, the UltraMod range is a family of GaN-based, multi-purpose, bi-directional, isolated, DC/DC converters. They are designed to

Five 1200V silicon carbide (SiC) MOSFETs released by Toshiba leverage the company’s third generation SiC technology, claimed to boost the energy efficiency of high voltage industrial applications. The TW015N120C, TW030N120C, TW045N120C, TW060N120C, and TW140N120C are designed for use in equipment such as electric vehicle (EV) charging stations, photovoltaic (PV) inverters, industrial power supplies, uninterruptible power

The first ATX motherboard with support for DDR5 from Aaeon, the ATX-Q670A, has enhanced security for industrial automation. The ATX-Q670A can provide a 50 per cent increase in bandwidth and also a decrease in power consumption compared to prior generations, said Aaeon. It is suitable for IoT applications and combines SATA performance with fast SSD

According to Innoscience Technology, the bi-GaN series of bi-directional GaN HEMT devices saves space and facilitates fast charging without risk of reliability-limiting and dangerous rises in temperature. Both of these effects can sometimes be seen in traditional silicon devices when fast charging, said the company.  The bi-GaN devices can be used inside phone handsets to

12th gen Intel Core SoC processors have been announced. Intel announced the line-up of purpose built edge processors which can be used to enhance graphics, AI for the IoT edge. According to Intel, the purpose-built edge SoC processors mark an industry first: a socketed SoC for high performance integrated graphics and media processing for visual

In-house engineers and designers have been assembled by Intelliconnect (Europe) to design bespoke RF connectivity products, delivered on fast lead times. The UK based specialist manufacturer of RF, waterproof and cryogenic connectors offers a custom connector and cable assembly design service to meet electrical performance, physicality, interface, water resistance materials, finish and obsolescence challenges.  Intelliconnect

Rugged data storage designed for mission critical AI and machine learning applications is available from Mercury Systems. The rugged data storage (RDS) system is a data centre-class, all-flash network attached storage (NAS) system which is ruggedised for mission-critical aerospace, defence and commercial edge applications.  The low latency, scalable enterprise RDS was developed in collaboration with

Harwin’s compact mezzanine connectors in the Archer.5 range are now available from Mouser Electronics. The 0.5mm board-to-board connectors are available with 30, 40, 80 and 100 pin count options. The contacts offer a current carrying capacity of 0.5A each.  The operating temperature range is between -55 to +85 degrees C, and the board-to-board stack height

Handheld enclosures in the Datec-Control range are designed to accommodate LCDs or displays. They are ergonomic, despite their large size, said OKW.  The handheld enclosures are available in two versions, either with or without a large cutout for a display module. There are four sizes of enclosures in the range, from XS (200 x 58mm